History of CMS and Atlas Pixel Detectors
CMS Pixels
CMS (D73,F),(D79,D80)
- history:
- 970719 F with CrAu pixel pattern at CERN
- 971013 D73 with CrAu/AZ4620 pixel pattern at CERN
- 971015 PSI receives new CMS readout chips.
- status:
- 971114 D73 to PSI with photoresist, bonding
- 971114 F to PSI with SiN, bonding
- 971127 D79,D80 with SiN to PSI bonding
- 980201 D79 back fron PSI, first bump bonding results
- 980301 D79 sent to OSU for new metallisation (Cr-Ni-Au)
ATLAS Pixels
LBL/Atlas (D73),(D79,D80)
- history:
- 970806 back from cutting
- 970821 D73, 1st complete Ti/W metalization
- 970822 to LBL for inspection
- 970826 back from LBL
- 970902 D73, 2nd complete Ti/W metalization
- 970903 D73, to LBL for inspection
- 970905 D73, to Boeing for bump bonding
- status:
- 971117 D73 LBL/RD42 Ru107 test at CERN,
- LBL readout integration in LEPSI DAQ.
- 980424 first test beam results with D73
Marseille-Bonn/Atlas (F),(D79)
- history:
- 970710 F back from cutting, then OSU
- 970719 F with CrAu pixel pattern at OSU
- 971013 decision not to use CrAu
- 971016 pixel pattern arrives from Marseille,
- decide to use Ti/Ni/Au
- 971201 new Ni target arrived at OSU
- 971215 D79 1st metallization: Ti/Ni/Au
- 971220 D79 2nd metallization: Cr/Ni/Au
- 980106 F, D79 4th metallization: Cr/Ni/Au
- 980109 processing on F,D79
- status:
- 980116 F,D79 contacts completed, awaiting passivation
- 980315 D79 arrived at CERN
- 980401 D79 goes back to OSU for new metallisation
- 980405 F arrives at CERN, will go to LETI for bumb bonding
- 980506 brought to LETI (Grenoble) for bump-bonding
- 980603 D79 arrived at CERN with a Ti-W metallisation
- 980617 practice piece D79 has been sent to Marseille (to Clemens)
- 980702 D73 (real detector) brought to LETI for bump bunding
- 980703 F sent to OSU
- 980825 tracker MB 73 and practice piece MB79 arrived at CERN
- 980826 tracker MB 73 and practice piece MB79 sent to LETI
Bonn-Marseille/Xray (D73), (D80)
- history:
- 970915 D73 at OSU
- 971016 readout chips arrive at CERN
- 971105 chips arrive at OSU
- 971201 D80 complete Ti/W metallization (sputtering)
- 971202 D73 complete Ti/W metallization (sputtering)
- 980702 D73 now in use for Marseille Bonn
- status:
to RD42 main page
Last modified: Thu Apr 16 18:28:21 METDST
Rudolf.Wedenig@cern.ch