Toronto Module B

note: Module B is currently on loan to Carleton.

1. June 2015: Fabrication

Module B fabrication was done at UofT under the instruction of Luise Poley. The sensor is silicon B-grade, so cannot be depleted. Like Module A, UV glue leaked out onto the hybrid bond pads from under the ASICs. In spite of this, all ASIC-to-hybrid bonds succeeded. The glue issue was due to incorrect usage of the microlitre pipette (see explanation in Section 1 of this link). See photos of hybrid/module B below.

note: Always make sure that you check T-to-T for the tooling (i.e.: there are T's carved onto one side of all the tooling which indicate which way the tools should be placed relative to the jig). I forgot to double check this while picking up the completed hybrid, and swished the ASIC-to-hybrid wire-bonds. In spite of this, the hybrid still works fine - we were lucky!

2. June 2015: Electrical Tests

TBA

note: everything worked fine

-- LaurelleMariaVeloce - 2015-12-09