ASIC Data sheet:

Explaination to columns:

1) lot name
2) wafer id
3) x
4) y
5) chip type 
6) prfflg -> Perfect flag: 1 = good  , 0 = bad
7) digflg -> Digital flag: 1 = good  , 0 = bad
8) dpp    -> Digital Perfect Pattern: 1 = good , 0 = bad
             1 - passes all dig. tests down to 3.3V @40MHz
                 and passes all dig. tests (except Slave) down
                 to 3.3V and Slave down to 3.4V @50MHz
         0 - fails definition above.
             This is additional flag which do not correspond with
             current selection criteria, but selects "perfect perfect
             digital" chips.
9) status -> BIN status of the chip (according to TestSpecification
documment)
             BIN Status: 0 = perfect, other values than zero correspond
             to BIN problem detected on that chip. i.e. :
             value: 1600 ->
             0000000000000011001000000
                   
             so BINs : 6,9,10 are set ->
 
             BIN  6 - "failed digital test #5 @ 3.8V & 50MHz"
             BIN  9 - "defect(s) in analog part 2"
             BIN 10 - "defect(s) in analog part 1, (no response to calib.
pulses)"

         (from "Testing specification for the wafer screening
              Project Name: ABCD3T ASIC Version: V1.3, 1 December, 2000"
              document, page 17 :
http://mic-jk.web.cern.ch/mic-jk/TestSpecABCD.pdf)
             
10) ndead -> number of unsuable channels (for different reason)
11) destination
12) date - last modification date (date of selection)
13) used -> 1 = used (sent,reserved) , 0 = available for selection
14) comment