21-Sept-1995
                                                          Carl Haber
 
to: Module Group
re: module measurement program
 
Below please find the list of module measurements discussed at Oxford
September 21, 1995  It was agreed that the results of these measurements 
could form the basis of a module decision.  Ideally, groups doing module 
prototyping should produce all the numbers discussed below.
 
present at dicussion: N.Unno, E.Perrin, G.Tappern, R.Bonino, 
C.Haber, R.Apsimon
 
1. Electrical
 
1.1 Noise measurements on fully bonded 12 cm strip.  Please indicate
detector geometry, technology, and configuration.
 
1.2 Delay Curve: vary calibration pulse with respect to pipeline clock to
check for pickup effects (see talk of H.Sadrozinski in Oxford module group
meeting).
 
1.3 Signal quality: probe digital signals on hybrid for reflections, 
risetime, delays, skewing at different positions on the hybrid.
 
1.4 Capacitance of fanout versus fanout strip length.
 
1.5 Bond position dependance (applies to Z module) compare noise of first
and last strip to middle strip in order to separate fanout effect from bond 
position effect (strip series resistance).
 
2. Thermal
 
2.1 Temperature profile on module for constant power in silicon and realistic
chip power (see specifications).
 
2.2 Simulation of runaway: for dummy modules use feedback on embedded wires,
for real module use irradiated detectors.
 
3. Mechanical
 
3.1 Document accuracy of assembled module.
 
3.2 If high temperature steps are used in module assembly document changes
which occur.
 
3.3 Measure deformations for cooldown with power load.
 
3.4 Extreme thermal cycle: -20 --> +70 degrees C  ten times
 
3.5 Estimate of additional support needed for mechanics and cooling
 
4. Materials
 
4.1 Provide spreadsheet of all materials used and properties
 
4.2 Calculate radiation lengths of all materials and components averaged
over a 6x12 cm area.
 
4.3 Provide a list of adhesives: cure schedules, glass transition temperatures,
radiation hardness if known.
 
4.4 Provide a list of encapsulants: cure schedules, radiation hardness
 
5. Assembly
 
5.1 Time estimates
 
5.2 List of special fixturing or tools needed
 
5.3 Wirebonding: demonstrate bondability, total number of bonds
    -are all surfaces compatible?  reworkable?
    -are there problems with vertical steps or excessive length bonds?
    -stiffness and deformation of components which are bonded
    -specify wire diameter
    -encapsulation (is the encapsulant reworkable? radiation hard?)