From:	SMTP%"jonest@hep.ph.liv.ac.uk" 16-JUN-1998 19:48:18.04
Subj:	Proposed change to Forward Module Design

Dear All,

We would like to propose the following change to the "evolving F-2" module
design. 

The change concerns the width of bare ceramic at the front of the readout
hybrid to which the fan-ins are glued. We would like to increase this by 2
mm making the hybrid base board 29.026 mm deep. There are 
corresponding changes to the TPG spine (item 9) and the "lower support"
(item 6).

This change is to allow support of the hybrid during the wirebonding of
the readout chips to the hybrid circuit and to increase the glue area
between the hybrid and the fan-ins. It does not affect the mounting area
or hole positions or the relationship between the mounting holes and the
silicon wafers.

An updated set of drawings for the outer module (NP27-03-112), together
with the modified hybrid shape (NP27-03-116) is now on WWW at

	http://jupiter.ph.liv.ac.uk/~peter/atlas/atlas.html

Tim