From unno@post.kek.jp Wed Mar  7 17:43:45 2001
Date: Wed, 7 Mar 2001 17:16:59 +0900 (JST)
From: Yoshinobu Unno <unno@post.kek.jp>
To: SCT barrel clusters -- Carl Haber <CHHaber@lbl.gov>,
    Yoshinobu Unno <unno@post.kek.jp>, Richard Brenner <brenner@tsl.uu.se>,
    Steinar Stapnes <steinar.stapnes@cern.ch>,
    Tony Carter <A.A.Carter@QMW.AC.UK>, Tord Ekelof <Tord.Ekelof@cern.ch>
Subject: Barrel module programme towards FDR

Dear the barrel clusters,

  Here is a summary of the chip and the barrel module programme for your
comments, towards the module FDR, discussed in the Feb. SCT week and
slightly modified considering delay of the ASIC distribution.  ASIC
distribution is already being delayed and we have great concern on
keeping the schedule in this draft.  Although having concern, we want to
keep in mind the schedule and move ahead as fast as we can.  Please
correct/amend.  

  If the barrel clusters has no critical objection, we will send the
ASIC request according to the draft.

					Nobu & Tony



============================================
Barrel module programme
(as of Feb. 01 SCT week, updated 2001/3/7)

1) ABCD3T"fixed" modules for irradiation (chip programme)	-- March

  3 modules (2 for normal token/data, 1 for bypass operation) 
    and 2 hybrids
  These are of "Chip programme", i.e., not "Module programme"
  It has been proposed to share as

  UK - 		1 module
		2 hybrids (1 with ABCD3T"fixed", 1 with W05 ABCD3T chips)
  Japan - 	2 modules

2) ABCD3T"fixed" modules	-- March

  8 modules (2 modules/cluster): 

    UK - 	2 modules
    Japan - 	2 modules
    Nordic - 	2 modules
    US - 	2 modules

  "Conductive glue, non-metalized chip, 220nF cap" hybrids
  "First quality" ABCD3T"fixed" chips - 8 mods x 14 chips = 112 chips

  These modules are to go through Module QA, and later to
  System test (2nd stage, i.e., 12 modules total, together with existing
  modules)



3) Completing 36 modules	-- April

  (Remaining) 21 modules

    UK - 	8 modules
    Japan - 	6 modules
    Nordic - 	3 modules
    US - 	4 modules

    (Already made including above item (2): 
     UK - 4 modules(?), Japan - 6 modules, Nordic - 3 modules, US - 2
          modules)
  
  These modules are to go through Module QA, accumulating statistics,
  and System test (final, 18 modules)

  

4) Thermo-mechanical modules	-- March-April

  with the latest baseboards
  Thermal profile, thermal runaway measurement - RAL/UK

  (Irradiated sensors are in stock at CERN for pick-up, if not
   picked-up)


5) Finalizing the specification	-- Feb - April

  Assessing and solving the problems

  Electrical performance
  z-flatness - correlation between bare, finished, and module
    -- all clusters with the modules in item (2) and (3)

  critical assessment of tolerance -- all, specially UK
  Any other?


6) FDR	Mid May 	-- May 14-16

  Results of measurements, QA, etc.
  Module documents
  Interface documents
  Procurement plan


7) Planning	-- Feb - FDR

  Long lead time ( > 6 months) - hybrid, baseboard procurement
  Baseboard tender action - now
  Hybrid tender action - as soon as after FDR
  Pilot run - if changes in the FDR


Appendix: Component acquisition

1) For irradiation and initial module fabrication:-- AS SOON AS POSSIBLE

  ABCD3T"fixed": 14x4=56 for irradiation (chip) programme
                 14x8=112 for module programme

     (an unit of 14 chips should be from the same wafer)

     UK - 	28+28 (in addition, W05-ABCD3T 14)
     Japan - 	28+28
     Nordic - 	28
     US - 	28

  Hybrid: 

     UK - 	6 (2 in-hand, 4 to be delivered from KEK)
     Japan - 	4 (to be delivered from KEK)
     Nordic - 	2 (3 in-hand(?))
     US - 	2 (4 in-hand(?))

  Baseboard: 

     UK - 	6 (to be delivered from UK)
     Japan - 	4 (2 in-hand, 2 to be delivered from UK)
     Nordic - 	2 (to be delivered(?))
     US - 	2 (to be delivered(?))

  Sensor:

     UK - 	12 (in-hand)
     Japan - 	16 (in-hand)
     Nordic - 	8 (in-hand)
     US - 	8 (in-hand(?))


(2) For completing the 36 module programme: BY END OF MARCH

  ASIC: (ABCD3T"fixed" or ABCD3T(?) to be determined by the time in 
         completing the initial programme)

    "First quality" chips - 21x14=294 chips

    UK - 	112
    Japan - 	84
    Nordic - 	42
    US - 	56


  Hybrid: (from KEK)

    UK - 	8 (to be delivered)
    Japan - 	6 (to be delivered)
    Nordic - 	2 (to be delivered)
    US - 	2 (to be delivered)

  Basebord: (from UK)

    UK - 	8 (to be delivered)
    Japan - 	6 (to be delivered)
    Nordic - 	2 (to be delivered)
    US - 	2 (to be delivered)

  Sensor:

    UK - 	32 (in-hand)
    Japan - 	24 (in-hand)
    Nordic - 	12 (in-hand)
    US - 	16 (to be delivered from KEK)