From M.Tyndel@rl.ac.uk Mon Nov 2 19:56:18 1998 Date: Fri, 23 Oct 1998 09:49:36 +0100 From: M.Tyndel@rl.ac.uk To: atlas-sct@atlas-lb.cern.ch Subject: SCT Module program Dear colleagues, This is the a copy of a proposal for the SCT Module program prepared by A. Carter and N. Unno. It has been presented to and discussed by the SCT Steering Group. There was strong support by the Steering Group, to try and focus the program especially for the Module-1 program. There will need to be convergence on the hybrid technology before Module-1. There was strong support for co-ordinated purchasing of components. Because of the shortage of time and components, the barrel and forward communities are encouraged to have a restricted number of module assembly sites (for the 20+20 PRR Module-1s) M. Tyndel & SCT Steering Group 23/10/1998 The modules programme through the MODULE -2 and MODULE -1 phases, and the associated FE chip allocations ________________________________________________________ 1. Overview ________ The overall module programme must now be well focussed towards providing fully proven modules of both B and F types by summer of 1999. These are needed both for ensuring successful progress in the project itself as well as providing the necessary data for the Module PRR, now planned for September 1999. Detailed measurements must be provided on: (1) cooling performance of single modules, especially when operating with irradiated detectors, and showing that they are capable of avoiding thermal runaway, (2) cooling contact performance with multiples of thermal modules, (3) mechanical integrity that proves adequate ridigity against the thermal and mechanical stresses, and (4) electrical performance of single and multiple modules. Partial measurements on (1) to (3) are already underway in various groups within the module community, and these must be completed by September 1999. The absence of FE chips has largely been responsible for delays to (4), but we believe that the newly fabricated ABCDs can allow the module electrical performance to be studied in the -2 versions in the near future. The modules being built over this winter could not be used within ATLAS SCT for either types, B or F, and are referred to as version -2. They cannot be part of the September 1999 module PRR where authorisation is sought for placing the major module production orders. This PRR requires modules having the full functionality and performance as specified for SCT use, constructed from components that are the same as those to be ordered for the subsequent series production. These PRR modules will be referred to as type -1. Their production must begin in early summer of 1999, with sufficient modules completed and tested during August 1999 for the review. It is planned that the complete -1 series will contain 20 B and 20 F electrical modules, with around one half of these being available to provide input for the PRR module. The most efficient project plan is to produce the module -1s, with agreed SCT -1 assembly tooling, at a limited number of sites for the summer of 1999. In the milestones agreed by the Institute Board on 11th September, the PRR to qualify all module sites individually for production is at the later date of July 2000. It is therefore important that the ongoing -2 prototype module programme is well focussed towards achieving the subsequent -1 construction targets. In particular, the limited number of module assembly components must now be used in the most effective way for the project. This applies most critically to the FE chips, but also to detector wafers, and later to the chosen hybrids. 2. Module -2 activities and the distribution of present ABCD chips. ________________________________________________________________ Wherever possible current module prototypes should be equipped with existing ABCD chips from the first run[ABCD1]. For performance studies that relate to hybrids and detectors it may be necessary to use chips from the more recent July delivery[ABCD2]. The success of the module -1 project in 1999 will depend on effective use in the coming -2 prototype work of the new ABCD2 chips. It is therefore necessary to link directly the allocation of ABCD2s to the module -1 production that will follow it. The final prototyping of hybrid technologies must also be done within the module -2 programme, and the agreed hybrids for both B and F modules should be decided during March 1999. We estimate that after functionality tests around 450 p-type ABCD2 chips should be available for use. Having assigning 150 of these for chip tests and 40 for detector wafer irradiation tests, around 260 ABCD2 p-type chips are left. This will allow a TOTAL of ONLY around 20 equipped modules to be made. We suggest allocating, in due course, 130 p-type chips to each of the barrel and forward programmes, but initially distributing only 60 to the forward and 72 to the barrel. This would allow work underway to be completed in a proper way and take into account the needs of the overall project. The module -2 production would them be: Forward: CE 3, CS 2, UK-V 3, Barrel: Japan 3, UK 3, US 1, Scand 1 with assembly at the agreed module -1 sites. The specific allocations of ABCD2 would then be: Type: Module -2 Initial ABCD2 Further ABCD2 ______________________________________________________________________ CE: Complete and evaluate 2*12 1*12 Kapton hybrids CS: To be defined 1*12 1*12 UK-V Complete and evaluate 2*12 1*12 BeO hybrids with integrated opto Japan Build 3 modules with 2*12 1*12 kapton hybrids UK Build 3 modules with 2*12 1*12 thin-film on TPG US Complete BeO hybrid 1*12 - evaluation Scand To be defined 1*12 _ _____________________________________________________________________ About 50 p-type ABCD2 chips would remain unallocated until about March 1999, when the situation should be re-assessed. A description of the modules that are to be made, and the components to be used, should be proposed and agreed in each case before ABCD2 chips can be used. We propose that the complete supply of tested ABCD2 chips be stored securely in Batiment 186 at CERN and all allocations be according to the agreed overall plan, with authorisation being given by the Module Co-ordinators, whose responsibility it would be to make the arrangement work. 3. The Module -1 programme _______________________ (1) The FE chips for Module -1 _______________________________ These modules have to be built with the chips to the SCT specification, expected to be available starting April/May 1999 from the imminent re-submission orders for both possible chip sets. The module -1 programme demonstrates the need for these orders to be initiated urgently, and for the higher of the two proposed options for wafer numbers to be purchased. Using present yield estimates, this would provide tested chips numbers of: CAFE-P 720 ABC 1140 ABCD 480^ + 480* (^ with trim DAC/ * without trim DAC) Basic design and performance verification of the FE chips needs 150 of each type, and detector wafer irradiation studies will need 40 of each chip set. This leaves for the module -1 production: CAFE-P 530 ABC 950 ABCD 290^ + 290* These numbers are barely compatible with the requirement to equip fully a total of 40 modules which, allowing something for assembly yields, must need a source of at least 500 chip sets. At this stage the total module -1 production is planned around the use of the first of the two possible chip sets that is available and shown to be successful. (2) The detectors and production plans for module -1 _____________________________________________________ We propose the following distribution of module -1 production: Barrel : Japan 8, UK 8, Scandinavia 2, USA 2, with module assembly taking place at only one site for each cluster. This will require further orders of barrel detectors. Allowing for module -2 requirements, we estimate an additional 30 to 40 detectors need to be ordered for delivery by JUNE 1999. Forward : CE 7, CS 6, UK-V 7, with module assembly taking place at only one site for each cluster. In this case three forward module types must presumably be covered at some level within this total. On the assumption that the detectors used for the production will be designed to the ATLAS specification, we estimate that at least 40 more such wafers must be ordered for delivery by JUNE 1999, of shapes to be agreed. ___________________________________________________________________________