Module Selection Criteria
(Updated: 1995/11/3)

(1) Electrical performance (Noise, ...)

1.1 Noise measurements on fully bonded 12 cm strip.  Compare with the
noise on no-bond and extract the noise due to making the module. Please
indicate detector geometry, technology, and configuration. 

1.2 Second noise measurment on two  consecutive triggers.  The 
measurmet should be done on data from the second trigger, as a 
function of the delay between the two.  The delay should cover the 
range of digitization time of the first trigger.

1.3 Bond position dependence (applies to Z module) compare noise of 
first and last strip to middle strip in order to separate fan-out/in 
effect from bond position effect (strip series resistance, fan-out 
length, glue length).  

1.4 Delay Curve: vary calibration pulse with respect to pipeline clock 
to check for pickup effects (see talk of H.Sadrozinski in Oxford 
module group meeting).  

1.5 Signal quality: probe digital signals on hybrid for reflections, 
risetime, delays, skewing at different positions on the hybrid.  

1.6 Capacitance measurements of fan-out/in (versus fan-out/in strip 
length).  Results for alumina, beryllia and CVD diamond, if possible.  
Compare the noises due to the fan-out/in with the results obtained for 
(1.1) and (1.2) (e.g., noises of the 2 chip APV5 Z module and the 
FELIX128, 4 chip Z module).  

(2) Radiation length

For existing modules, and for the final ATLAS modules for the 
configuration of Binary and Analog/Digital readouts, 

2.1 Provide spreadsheet of all materials used and properties, 
including the additional support needed for mechanics and cooling.  

2.2 Calculate radiation lengths of all materials and components 
locally and averaged over a 6x12 cm area.

2.3 Provide a list of adhesives: cure schedules, glass transition 
temperatures, radiation hardness if known.

2.4 Provide a list of encapsulants: cure schedules, radiation hardness

(3) Thermal performance

3.1 Temperature profile across a complete (thermal) module, mounted on a
realistic cooled support, for constant power in silicon and chip (see
specifications).  The measurement should be made with the coolant
temperature approximately equal to the ambient air temp. (e.g., the room
temp. or controlled 0 degC, 20 degC, ...) and +-10degC higher/lower. The
results should be compared with a corresponding finite element analysis.

3.2 Reproducibility of the thermal contact to the cooling element.  
The measurement (3.1) should be obtained for several modules mounted 
on a common structure.  If this is not possible one or two modules 
should be repeatedly mounted on the structure (e.g., 5 times) and 
temperature profile variations obtained.  

3.3 Simulation of runaway: use feedback on embedded wires, or use 
irradiated detectors, compare the results with a finite element 
analysis.  

(4) Mechanical performance
 (See "Module Specification" for tolerance numbers)

4.1 Measurement of thermally induced distortions.  This should be 
measured with an instrument (preferably of the non-contact type) with 
a resolution in the bending plane of better than or equal to 10 
microns.  Measure distortion as a function of chip power, detector 
power, and possibly coolant and ambient temperatures (+20, +10, 0, 
-10degC), and compare with finite element results.  The distortion 
should be measured for non-uniform heating, e.g., roofing in the f 
direction.  

4.2 Reproducibility of the module placement accuracy that can be 
(regularly) achieved for modules on staves and cylinders.  

4.3 Extreme thermal cycle: -20 --> +70 degC  ten times.  

4.4 Detailed assembly procedures should be provided, with suitable 
drawings, for both the current H8 modules and future planned designs.  
Estimates should be given of the alignment accuracy achieved against 
the design values.  the reasons for discrepancies should be outlined.  
 
4.5 If high temperature steps are used in module assembly document 
changes which occur.  

4.6 Wire bonding: demonstrate bondability, total number of bonds
- Are all surfaces compatible?  reworkable?
- Are there problems with vertical steps or excessive length bonds?
- Stiffness and deformation of components which are bonded
- Specify wire diameter
- Encapsulation (is the encapsulant reworkable? radiation hard?)

(5) Cost aspects

5.1 List of special fixturing or tools needed

5.2 Time estimates for assembling and testing

5.3 Estimates on assembly yield
 
5.4 Document cost of components and manpower.

(6) Construction aspects

6.1 Document mounting arrangement on to the support element

6.2 Document services and connectivity

6.3 Document repairability

6.4 Document safety issues and use of hazardous materials