Suggested Areas to Pursue (quite possibly some are in process or completed)
 
	Analysis
		FEA Tasks(Consider both single phase and binary-ice options)
		1. Silicon Detector module combined with cooling and
structural support. Solve for thermal strains from cool down.  Studies
tend to focus on isolated module with highly idealized boundary
conditions for the mounting interface. Will grease be used to decouple
the module from the structure, or are there still materials with
different CTE's still coupled mechanically to the silicon module? 

		2. FEA to illustrate that the long cooling tubes do not
impose strains on the module, either from gravity effects or from
thermal effects.  This possibly would be suggested in the R-phi module
concept. 

		3. FEA of dynamic loads from cooling tubes, eg.,
vibration of a tube suspended at discrete number of points in a grease
filled gravity.  What effect if any,  will be imposed on silicon module
support. 

		4. 3-dimensional FEA of composite shell that assesses
how flexible the composite surface facing is to local loads.  This is
important to consider should the core be foam, but most likely not an
issue for honeycomb(significantly greater cost).  Purpose to examine
local deformations that may cause unacceptable misalignments of the
silicon module.  Possible loads are eccentric loading from cooling
system(tube) support. 

		Alignment
		1.  Analysis of manufacturing tolerances required to
achieve silicon detector location.  Would include cost to produce all
precision component mounting interfaces, locating pin references, etc. 
Apportioning tolerances must include provision for location of one layer
to another layer.  This study should be coupled with an overall cost
analysis of competing designs. 

		Cost 
		1.  Cost evaluation of separate approaches being
proposed.  Analysis of cost should encompass more than a cost of a
tubular frame versus a composite shell.  Breakdown should include
elements for detector support and cooling, as well as the manufacturing
costs to achieve stringent tolerances, if applicable. 
 
Prototype Tests
		Detector cooling

		1.  Silicon module supported and integrated with cooling
system as proposed in final design.   Cooling test with both single
phase and binary-ice fluid system. 

		2.  More tests on the binary-ice system to expand
fundamental understanding.  Also, tests simulating the method of
detector cooling, grease interface, etc.  A test devoted to uniform heat
flux along tube length is essential to the Pixel detector development. 

		3.  Multiple module cooling test(conditioned at -15 Deg.
C) integrated with support structure to ensure unanticipated coupling
does not exist, nor that flexibility in a shell mount support  system
becomes an issue. Simulate effect of cable loads imposed on the delicate
support for the silicon module.  Examine structural deformations with
holographic testing at Oxford.