From Antony.Carter@cern.ch Wed Oct 20 20:20:39 1999
Date: Wed, 20 Oct 1999 12:15:12 +0200
From: Antony.Carter@cern.ch
To: ATLAS-SCT@atlas-lb.cern.ch
Subject: SCT components: packaging and transport


  Dear SCT Colleagues,

                         Packaging and Transport
                         _______________________

 The SCT Module programme is now moving into a production phase where 
 significant numbers of component items and complete units are being produced.
 This is requiring the movement and exchange between institutes and 
 construction sites of many delicate and sensitive items, including silicon
 detectors, ASICs, hybrids, facings, cables and various assembled systems.

 It has been pointed out to us that not all items, until now, have been
 packaged for such movements in a way that guarantees their safe journey or
 indeed their functionality or cleanliness. Clearly we have to be as careful
 as possible in the way all parts of the assemblies are handled, adopting a
 "clean room" approach for all components. For these reasons we would urge 
 everyone to take the necessary steps to ensure that packaging and transport 
 of SCT components and modules is done to an appropiate professional standard.

                                      Thanks,    Tony and Nobu.

 ________________________________________________________________________________

From Jan.Kaplon@cern.ch Wed Oct 20 20:20:14 1999
Date: Wed, 20 Oct 1999 12:40:24 +0200 (METDST)
From: Jan Kaplon <Jan.Kaplon@cern.ch>
To: Antony.Carter@cern.ch
Cc: ATLAS-SCT@atlas-lb.cern.ch
Subject: Re: SCT components: packaging and transport

Dear SCT Colleagues,
In response to mail from Tony and Nobu, I would like to inform all people
who will get ABCDs chips from CERN that they will be distributed in
the GEL-PAK boxes. Chips are laying on gel surface during transportation,
to remove the chips from this surface you HAVE to apply the vacuum on the
rear side of the box. Then the chips can be easily picked off.
Regards, Jan Kaplon.